We specialize in producing high-quality double-sided to multi-layer PCBs (up to 20 layers), with advanced support for:
We support this with staggered via technology and advanced layer-to-layer alignment processes to ensure the reliability of HDI boards. For detailed design rules, please refer to the technical documentation.
Standard process supports 4/4 mil (0.1 mm), while advanced process can achieve 3/3 mil. Specific capabilities depend on material and layer count evaluation.
