High-frequency material selection, strict impedance control, low-loss copper foil, and PTFE hybrid lamination technology.
We use high-TG materials (170°C+), conformal coating, and 100% functional testing, with UL certification compliance.
Heavy copper design (2-6oz), enhanced thermal dissipation structures, and 72-hour high/low temperature cycling tests.
Ultra-thin flexible boards (0.2mm), miniaturized component placement, and high-precision impedance matching.
